The Rogers RO1200® XtremeSpeed Bondply is an advanced PCB material specifically designed for high-speed digital applications, making it ideal for systems operating at 56Gbps and 112Gbps. This ceramic-filled, non-glass reinforced PTFE bondply combines a low-loss resin system with high-performance rolled copper foil, providing an unmatched solution in terms of signal integrity and speed. The material is particularly well-suited for applications requiring tight impedance control and high reliability, such as core/edge IP routers, high-performance computing servers, and automated test equipment .

When building a PCB stackup using the RO1200® XtremeSpeed Bondply, consider the following technical specifications and features:

• Dielectric constant of 2.99 and a dissipation factor of 0.0012 at 10 GHz, ensuring minimal signal loss and excellent electrical performance across the board .
• Available in thickness options of 2.5, 3.0, 4.0, and 5.0 mils, allowing for flexibility in design and impedance matching by stacking plies to achieve the desired outcome .
• Low coefficient of thermal expansion (CTE) of 29 ppm/°C across a wide temperature range from -55 °C to 288 °C, which contributes to outstanding thermal and mechanical stability under varying environmental conditions .

For engineers aiming to maximize the performance of their high-speed digital systems, using the RO1200® XtremeSpeed Bondply in conjunction with RO1200 laminate products is recommended. This combination ensures a homogeneous dielectric environment and optimal signal integrity. Additionally, the material's superior thermal properties and compatibility with lead-free processes make it a robust choice for demanding applications that require high reliability and durability .